IEC/TR 62258-3-2005 半导体压模产品.第3部分:搬运、包装和储存的良好实施规程建议

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                   【英文标准名称】:     Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage            【原文标准名称】:     半导体压模产品.第3部分:搬运、包装和储存的良好实施规程建议            【标准号】:     IEC/TR 62258-3-2005            【标准状态】:     作废            【国别】:     国际            【发布日期】:     2005-06    【实施或试行日期】: 【发布单位】: 国际电工委员会(IX-IEC)【起草单位】: IEC/TC 47【标准类型】: ()【标准水平】: ()【中文主题词】: 薄片;环境试验;无菌室;规范(验收);应用;集成电路;半导体器件;半导体;电气工程;组件;电子设备及元件;洁净室技术;组装件;连接;芯片;电子工程;生产;环境条件;储存;材料;搬运;试验【英文主题词】: Assemblies;Chips;Clean rooms;Clean-room technology;Components;Connections;Ejection;Electrical engineering;Electronic engineering;Electronic equipment and components;Environmental conditions;Environmental testing;Handling;Integrated circuits;Materialsroduction;Semiconductor devices;Semiconductors;Specification (approval);Storage;Testing;Use;Wafers【摘要】: This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: - singulated bare die, - minimally or partially encapsulated die and wafers. This report contains suggested good practice for【中国标准分类号】: L40【国际标准分类号】: 31_200【页数】: 50P.;A4【正文语种】: 英语         
         

ABin_Liu

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