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标题: IEC 60749-23-2004 半导体器件.机械和气候试验方法.第23部分:高温操作寿命 [打印本页]

作者: sigh007 时间: 2012-3-24 14:01:36 标题: IEC 60749-23-2004 半导体器件.机械和气候试验方法.第23部分:高温操作寿命

【英文标准名称】: Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life 【原文标准名称】: 半导体器件.机械和气候试验方法.第23部分:高温操作寿命【标准号】: IEC 60749-23-2004 【标准状态】: 现行【国别】: 国际【发布日期】: 2004-02 【实施或试行日期】: 【发布单位】: 国际电工委员会(IX-IEC)【起草单位】: IEC/TC 47【标准类型】: ()【标准水平】: ()【中文主题词】: 机械试验;高温试验;半导体器件;粘结强度;电子设备及元件;电气工程;试验;集成电路;环境试验;组件;半导体;气候试验;电子工程;定义【英文主题词】: Bond strength;Climate;Climatic tests;Components;Defects;Definitions;Electrical engineering;Electrical measurement;Electronic engineering;Electronic equipment and components;Environmental testing;Environmental tests;High-temperature testing;Integrated circuits;Life (durability);Life test;Mechanical testing;Moisture test

erformance in service

restress;Quality assurance;Semiconductor devices;Semiconductors;Simulation;Stress time;Temperature test;Testing【摘要】: This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.【中国标准分类号】: L40【国际标准分类号】: 31_080_01【页数】: 26P.;A4【正文语种】: 英语

作者: 豹子头 时间: 2014-8-13 10:11:25

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