BS 4584-103.2-1990 Metal-clad base materials for printed wiring boards — Part 103: Special materials used in connection with printed circuits — Section 103.2 Specification for copper foil for use in the manufacture of copper-clad base materials
印制电路用基材 第103部分：印制电路连接用特殊材料 第2节：覆铜板制造用铜箔规范