ower electronics;Resistance;Semiconductor devices;Semiconductors;Simulation;Testing;Testing conditions【摘要】: Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward condu【中国标准分类号】: L40【国际标准分类号】: 31_080_01【页数】: 30P.;A4【正文语种】: 英语 | 欢迎光临 世界资料网论坛 (http://bbs.infoeach.com/) | Powered by Discuz! X2.5 |