标题: IEC 60749-20:2008 Semiconductor devices – Mechanical and climatic test methods [打印本页] 作者: hgundas 时间: 2020-4-23 21:35:06 标题: IEC 60749-20:2008 Semiconductor devices – Mechanical and climatic test methods
[attach]224312[/attach] IEC 60749-20:2008
Semiconductor devices – Mechanical and climatic test methods –
Part 20: Resistance of plastic encapsulated SMDs to the combined effect of
moisture and soldering heat