Product Code:SAE AMS3690Title:Adhesive Compound, Epoxy, Room Temperature CuringIssuing Committee:Ams P17 Composite Materials CommitteeScope:This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.This adhesive compound has been used typically for nonstructural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components operating at not higher than 185 °F (85 °C), but usage is not limited to such applications.