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标题: 求IEC 60749-20:2020 [打印本页]

作者: acpattetc 时间: 2021-3-5 17:23:15 标题: 求IEC 60749-20:2020

求IEC 60749-20:2020

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

半导体器件机械和气候试验方法第20部分：塑封表面安装器件耐潮湿和焊接热综合影响

作者: liuxilin1215 时间: 2021-3-5 17:23:16

IEC 60749-20-2020 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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