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roduction;Semiconductor chips;Semiconductor devices;Semiconductors;Specification (approval);Testing;Wafers【摘要】: This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to - singulated bare die, - minimally or partially encapsulated die and wafers. This standard specifies the da【中国标准分类号】: L40【国际标准分类号】: 31_200【页数】: 72P.;A4【正文语种】: 英语 | 欢迎光临 世界资料网论坛 (http://bbs.infoeach.com/) | Powered by Discuz! X2.5 |