BS 4584-103.1-1990 印制电路用基材 第103部分：印制电路连接用特
BS 4584-103.1-1990 Metal-clad base materials for printed wiring boards — Part 103: Special materials used in connection with printed circuits — Section 103.1 Specification for prepreg for use as a bonging sheet material in the fabrication of multilayer printed boards印制电路用基材 第103部分：印制电路连接用特殊材料 第1节：多层印制电路板制造用粘结片材的半固化片规范
谢谢您的分享，金币已奖励。
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