acpattetc 发表于 2021-3-5 17:23:15

求IEC 60749-20:2020

求IEC 60749-20:2020

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

半导体器件 机械和气候试验方法 第20部分：塑封表面安装器件耐潮湿和焊接热综合影响


liuxilin1215 发表于 2021-3-5 17:23:16

IEC 60749-20-2020 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat


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