lotus999 发表于 2020-4-9 08:50:22

IEC 61190-1-3:2017 --高清可编辑

IEC 61190-1-3:2017
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Publication date: 2017-12-13
Edition: 3.0

admin 发表于 2020-4-17 23:00:20

谢谢您的分享，金币已奖励!
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