upriw 发表于 2020-3-20 09:44:01

IEC 61190-1-3:2017

IEC 61190-1-3:2017
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Publication date: 2017-12-13
Edition: 3.0

lotus999 发表于 2020-3-20 09:44:02

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lotus999 发表于 2020-4-9 08:50:42

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