liuxilin1215 发表于 2019-5-5 09:07:16

BS IEC 62047-31-2019 Semiconductor devices - Micro- electromechanical devices Pa

BS IEC 62047-31-2019 Semiconductor devices - Micro- electromechanical devices Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials



admin 发表于 2019-5-11 16:58:37

谢谢您的分享,金币已奖励!
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